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> SMD assembly process
SMD assembly process
Pre-Assembly Preparation
Verify the assembly schedule and requirements.
Gather all necessary components and materials.
Inspect components for damage or defects.
Ensure all tools and equipment are calibrated and in good condition.
PCB Preparation
Clean the PCB surface to remove dust and contaminants.
Apply solder paste using a stencil or automatic printer.
Inspect solder paste application for accuracy and consistency.
Component Placement
Confirm the component placement plan.
Use a pick-and-place machine to position components on the PCB.
Manually place components if necessary, ensuring proper orientation.
Verify placement using optical inspection or fiducial marks.
Soldering Process
Select the appropriate soldering method (reflow, wave, or hand soldering).
Set up the reflow oven with the correct temperature profile.
Monitor the soldering process to ensure proper solder joints.
Inspect solder joints for quality and defects.
Post-Assembly Inspection
Conduct visual inspection of the assembled PCB.
Perform Automated Optical Inspection (AOI) if available.
Test for electrical continuity and functionality.
Document any defects and corrective actions taken.
Final Assembly and Packaging
Clean the assembled PCBs to remove flux residues.
Perform final functional testing on completed assemblies.
Package the assemblies securely for shipping or storage.
Update inventory and documentation for completed assemblies.
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